Create permanent connections between fired metal clay pieces as well as sterling, fine silver and Argentium findings without having to use solder and a torch. Clay-Bond Plus™, a metal alloy powder, becomes a paste when mixed with water and acts like a solder/adhesive for metal findings.
Use a brush with short, stiff bristles to apply the paste to the two metal pieces you want to join. The binder ingredients in Clay-Bond Plus dry in minutes, holding firmly to prevent the pieces from moving or separating before and during firing.
When using Clay-Bond Plus with metal clay, arrange joined pieces in a small-size firing pan, embedded in activated carbon. During firing, the Clay-Bond Plus creates a strong, permanent connection anywhere it was applied. Each jar contains 5 grams of powder.
Metal clay pieces must be fired normally before using them with Clay Bond Plus™; unfired clay is not suitable for Clay Bond Plus.